Thank you for your vested interest in part number DEL1403N-70LM, one of the many Microcircuit Memory items we offer from Sgs Thompson Microelectronics Inc. On this page, you can easily fill out a Request for Quote (RFQ) form for NSN 5962012485010 that caters to your requirements. Simply fill out the form below with details about your situation, such as desired part quantity and expected shipping deadline, and a dedicated account manager will reach out to you with a competitive quote for your comparisons in 15 minutes or less. For more information, you are also welcome to contact us at any time via phone or email, as we are available around the clock!
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Aside from the NSN 5962-01-248-5010, we carry a host of other parts within the Federal Supply Class 5962 Microcircuits Electronic. Each of these items are fully traceable and have been sourced from credible manufacturers whom we trust, including Sgs Thompson Microelectronics Inc with the CAGE Code 60911. Additionally, you can count on us for quality-evaluated products that come delivered with their qualifying certifications and manufacturer trace documentation, as applicable. Regardless of your situation, NSN Matrix is here to assist you with all the logistics behind part procurement, so kick off the purchasing process with us today to learn how we can get you the parts your operations require ASAP!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-248-5010 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012485010 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT6167L70LB | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.085 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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